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Sony PlayStation 5 die shown in detail thanks to high-resolution photos

Storm Agency

New photos of the PlayStation 5’s die have showcased the chip in great detail. Sony’s SoC contains 8 CPU cores, 36 GPU cores and larger memory interfaces linking the chip to the console’s 16 GB of GDDR6 VRAM.

Fritzchens Fritz has shared more photos of the PlayStation 5’s die, having first done so in February. Both versions of Sony’s latest console feature an 8-core Zen 2 CPU and an RDNA 2 GPU with 36 Compute Units (CUs), which delivers up to 10.28 TFLOPS of performance.

As the images below show, the Zen 2 CPU cores take up hardly any space on the PlayStation 5’s die, roughly an eighth by our count. Similarly, the GDDR6 memory interfaces occupy a small amount of territory on the die’s longer sides.

Unsurprisingly, the RDNA 2 GPU dominates the die, with L2 cache and unified memory controllers dividing the GPU into two parts. A large area of L1 cache sits in each side of the GPU, too.

Typically, it takes developers years to extract the most performance from a console. However, Spider-Man: Miles Morales and Ratchet & Clank: Rift Apart have offered a glimpse at what could end up arriving across all PlayStation 5 games, such as ultra-fast loading times and eye-catching graphics.

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